RGTS
Robot Gap & Teaching Measurement System
For 300mm wafer
Positional precision measurement for transfer robots
Real-time measurement of level and distance between Robot EE and wafers based on the wafer inside the FOUP
Robot teaching reference through vision analysis
- Key Features
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1. Distance between Robot EE and wafer measured with a laser displacement sensor * Robot EE = Edge grip type
2. Gap measurement between Robot EE's stopper and wafer through vision analysis * Robot EE = Edge grip type
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Lower-part image taken and analyzed for Robot EE at the time of wafer pick up
3. Why do you need RGTS?
Problems with existing methods
High risk of safety accidents due to human error
Only experienced experts can check the status of robots
Accurate measurement not possible with visual inspection, and measurement reliability is low
Tool down time of at least 1 hour
Strengths of RGTS
Safety : No need for a person to enter the equipment for robot inspection
Easy : Use is possible by any equipment operator, including non-experts in robotics, without manual robot control
Fast : Inspection time reduced to 1/10 compared to existing methods, and tool downtime reduced (previously100 minutes -> now 10 minutes), 100 minutes: Excluding paperwork for environmental safety approval
Accuracy : Precise 2D/3D measurements with laser displacement sensors and cameras, with measurements accurate to 0.01mm and an error margin < 0.3mm
Cost-effectiveness : Capable of simultaneously handling multiple robots with a single RGTS
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1
Rapid measurement
Analysis completed with one
wafer pick-up within 10 minutes -
2
Accurate measurement
Improved accuracy and precision with high-resolution measurements
Image: 1280 x 960, Laser sensor: 0.01mm -
3
Easy use
It can be used by anyone,
even without specialized expertise
